August 2025 Blow Molding Blog
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August 6, 2025
Barrier Packaging Solutions Developed by Nestlé and IBM Using AI
Barrier Packaging Solutions Developed by Nestlé and IBM Using AI
Nestlé has announced a new collaboration with IBM to harness generative AI for discovering next-generation high-barrier packaging materials that protect food while meeting sustainability goals. The AI will evaluate cost, recyclability, and performance, ensuring materials deliver both environmental and functional benefits.
Central to the initiative is an AI-powered knowledge base, built from public and proprietary records, that will use a fine-tuned chemical language model to interpret molecular structures. By correlating molecular features with physical-chemical properties, the system will propose novel packaging solutions capable of shielding sensitive products from moisture, oxygen, and temperature fluctuations.
This packaging innovation aligns with Nestlé’s broader deep tech ambitions. The company is establishing a deep tech center at its System Technology Center in Orbe, Switzerland, set to open in the first half of 2026. The facility will focus on advanced R&D in sensors, robotics, AI, coding systems, and virtual/mixed reality to improve research, innovation, and operational efficiency.
The deep tech center will also drive advancements in smart manufacturing, including “dynamic quality assurance” using high-resolution imaging to monitor packaging seals and ensure product safety in real time. Machine learning will enable predictive maintenance and process optimization, while “self-controlling equipment” will support “zero-touch” manufacturing systems that automatically adjust operations for maximum efficiency, consistency, and quality. Learn more about this topic here.
Central to the initiative is an AI-powered knowledge base, built from public and proprietary records, that will use a fine-tuned chemical language model to interpret molecular structures. By correlating molecular features with physical-chemical properties, the system will propose novel packaging solutions capable of shielding sensitive products from moisture, oxygen, and temperature fluctuations.
This packaging innovation aligns with Nestlé’s broader deep tech ambitions. The company is establishing a deep tech center at its System Technology Center in Orbe, Switzerland, set to open in the first half of 2026. The facility will focus on advanced R&D in sensors, robotics, AI, coding systems, and virtual/mixed reality to improve research, innovation, and operational efficiency.
The deep tech center will also drive advancements in smart manufacturing, including “dynamic quality assurance” using high-resolution imaging to monitor packaging seals and ensure product safety in real time. Machine learning will enable predictive maintenance and process optimization, while “self-controlling equipment” will support “zero-touch” manufacturing systems that automatically adjust operations for maximum efficiency, consistency, and quality. Learn more about this topic here.
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